This JEDEC standard was approved for rescission by acclamation of theJEDEC Board of Directors on May 2, 2011 under Board Ballot JCB-11-23 asrecommended by the JEDEC JC-13.5 Subcommittee.This document is being rescinded on the basis that the information containedwithin has been updated, revised, and incorporated into JESD9B, InspectionCriteria for Microelectronic Packages and Covers, published May 2011. Thisdocument is no longer available on the JEDEC website.
The intent of this standard is to be a guide in the manufacture and procurement of ceramic packages, especially for the hybrid industry. Manufacturers or ceramic packages and procuring activities for these packages will now be able to use this document as the means for agreement in the imposition of minimum requirements in qualification, screening, and quality conformance.
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