Description
1.1 This specification covers twelve grades of thermosetting laminate with copper foil bonded to one or both surfaces. These combination forms are intended primarily for use in fabrication of printed (etched) wiring or circuit boards.
Product Details
- Published:
- 11/01/2013
- Number of Pages:
- 5
- File Size:
- 1 file , 84 KB
- Redline File Size:
- 2 files , 190 KB
