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JEDEC JESD51-32 PDF Download

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THERMAL TEST BOARD STANDARDS TO ACCOMMODATE MULTI-CHIP PACKAGES
standard by JEDEC Solid State Technology Association, 12/01/2010

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Description

This document addresses the need for extending the existing thermal test board standards to accommodate the potential of higher electrical connection needs of multi-chip packages (MCPs) and the associated wire routing to implement these connections. The extensions described in this standard are also applicable to single chip packages needing more than 36 electrical connections for the test.

Product Details

Published:
12/01/2010
Number of Pages:
10
File Size:
1 file , 38 KB