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JEDEC JESD22-B106E PDF Download

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RESISTANCE TO SOLDER SHOCK FOR THROUGH-HOLE MOUNTED DEVICES
standard by JEDEC Solid State Technology Association, 11/01/2016

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Description

This test method is used to determine whether solid state devices can withstand the effect of the temperature shock to which they will be subjected during soldering of their leads in a solder wave process and/or solder fountain (rework/replacement) process. The heat is conducted through the leads into the device package from solder heat at the reverse side of the board.

Product Details

Published:
11/01/2016
Number of Pages:
14
File Size:
1 file , 54 KB