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JEDEC JESD22-B106D PDF Download

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RESISTANCE TO SOLDER SHOCK FOR THROUGH-HOLE MOUNTED DEVICES
standard by JEDEC Solid State Technology Association, 04/01/2008

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Description

This method established a standard procedure for determining whether through-hole solid state devices can withstand the effects of the temperature to which they will be subject during soldering of their leads. This revision updates the references to currently military standards.

Product Details

Published:
04/01/2008
Number of Pages:
12
File Size:
1 file , 70 KB