Sale!

JEDEC JESD 9-A PDF Download

$55.00

METAL PACKAGE SPECIFICATION FOR MICROELECTRONIC PACKAGES AND COVERS
standard by JEDEC Solid State Technology Association, 04/01/1987

Formats: PDF   In Stock

Category:

Description

This standard establishes the general requirements and quality assurance provisions that can be specified and met in procuring microelectronics packages and covers, manufactured from matched seal with and without high thermal conductivity base materials, intended for use in fabricating hybrid microelectronics circuits. This document details those minimum requirements necessary for metal packages’ use exclusively.

Product Details

Published:
04/01/1987
Number of Pages:
55
File Size:
1 file , 810 KB