Description
Provides a guide to an interconnection system for circuit board partitioning, allowing for a modular construction and solderless assembly of the sub-units.
Cross References:
BS 2011:Part 1.1
BS 2011:Part 2.1Ea
BS 2011:Part 2.1Eb
BS 2011:Part 2.1Fc
BS 2011:Part 2.1M
BS 5954:Part 2
BS 5954:Part 3
BS CECC 00015:Part 1
IEC 603-2
Product Details
- Published:
- 03/15/1993
- ISBN(s):
- 0580210677
- Number of Pages:
- 40
- File Size:
- 1 file , 1.1 MB
- Product Code(s):
- 00292602, 00292602, 00292602
